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Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers
Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers
Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers
Shen, L. (Autor:in) / Tan, Z. Y. (Autor:in) / Chen, Z. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 561 ; 232-238
01.01.2013
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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