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Thermal processing of strained silicon-on-insulator for atomically precise silicon device fabrication
Thermal processing of strained silicon-on-insulator for atomically precise silicon device fabrication
Thermal processing of strained silicon-on-insulator for atomically precise silicon device fabrication
Lee, W. C. (Autor:in) / Bishop, N. (Autor:in) / Thompson, D. L. (Autor:in) / Xue, K. (Autor:in) / Scappucci, G. (Autor:in) / Cederberg, J. G. (Autor:in) / Gray, J. K. (Autor:in) / Han, S. M. (Autor:in) / Celler, G. K. (Autor:in) / Carroll, M. S. (Autor:in)
APPLIED SURFACE SCIENCE ; 265 ; 833-838
01.01.2013
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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