Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

Flores, J. G. / Cervantes, J. / Lemus, J. | British Library Online Contents | 2006

Effects of FGM Interlayer on Joining Aluminum Nitride Ceramics to Copper

Zhu, S. / Wlosinski, W. / Xu, B. | British Library Online Contents | 2003

Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Song, X. G. / Cao, J. / Chen, H. Y. et al. | British Library Online Contents | 2013

Silicon nitride joining for high temperature applications

Glass, S.J. / Hosking, F.M. / Loehman, R.E. et al. | British Library Online Contents | 1998

Silicon nitride joining for high temperature applications

Glass, S. J. / Hosking, F. M. / Loehman, R. E. et al. | British Library Online Contents | 1998