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A platform for research: civil engineering, architecture and urbanism
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer
Wu, Y. H. (author) / Yu, C. Y. (author) / Ho, C. Y. (author) / Duh, J. G. (author)
MATERIALS LETTERS ; 105 ; 40-42
2013-01-01
3 pages
Article (Journal)
English
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