Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders

El-Daly, A.A. / El-Taher, A.M. / Dalloul, T.R. | Elsevier | 2013

Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. et al. | British Library Online Contents | 2007

Evaluation of the joint strength between Sn–3.0Ag–0.5Cu solders and Cu substrate at high strain rates

You, I. D. / Kim, H. K. | British Library Online Contents | 2012

A Green Approach to Synthesis of Nanoparticles of Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy

Pang, S.-k. / Yung, K.-c. | British Library Online Contents | 2012

Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

Gao, F. / Cheng, F. / Nishikawa, H. et al. | British Library Online Contents | 2008