Effects of incident cluster size, substrate temperature, and incident energy on bombardment of Ni clusters onto Cu (001) surface studied using molecular dynamics simulation

Lin, S. J. / Wu, C. D. / Fang, T. H. et al. | British Library Online Contents | 2012

The effect of deposition velocity and cluster size on thin film growth by Cu cluster deposition

Gong, H. / Lu, W. / Wang, L. et al. | British Library Online Contents | 2012

Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition

Su, M. H. / Lu, J. M. | British Library Online Contents | 2006

Information-limited Incident Size Prediction

Englehardt, J. D. / Canadian Society for Civil Engineering; Environmental Engineering Division / American Society of Civil Engineers; Environmental Engineering Division | British Library Conference Proceedings | 1993

Controlling energy deposition during the C60+ bombardment of silicon: The effect of incident angle geometry

Kozole, J. / Winograd, N. | British Library Online Contents | 2008