Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
4H-SiC Planarization Using Catalyst-Referred Etching with Pure Water
4H-SiC Planarization Using Catalyst-Referred Etching with Pure Water
4H-SiC Planarization Using Catalyst-Referred Etching with Pure Water
Isohashi, A. (Autor:in) / Sano, Y. (Autor:in) / Sadakuni, S. (Autor:in) / Yamauchi, K. (Autor:in) / Okumura, H. / Harima, H. / Kimoto, T. / Yoshimoto, M. / Watanabe, H. / Hatayama, T.
01.01.2014
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Damage-Free Planarization of 4H-SiC (0001) by Catalyst-Referred Etching
British Library Online Contents | 2007
|Abrasive-Free Planarization of 3-Inch 4H-SiC Substrate Using Catalyst-Referred Etching
British Library Online Contents | 2011
|British Library Online Contents | 2014
|Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper
British Library Online Contents | 2010
|British Library Online Contents | 2012
|