Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating
Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating
Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating
Petukhov, D. I. (Autor:in) / Kirikova, M. N. (Autor:in) / Bessonov, A. A. (Autor:in) / Bailey, M. J. (Autor:in)
MATERIALS LETTERS ; 132 ; 302-306
01.01.2014
5 pages
Aufsatz (Zeitschrift)
Englisch
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| British Library Online Contents | 2017
| British Library Online Contents | 2017
| British Library Online Contents | 2017
High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating
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