Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating
High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating
High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating
Lv, Ming (Autor:in) / Liu, Jianguo (Autor:in) / Zeng, Xiaoyan (Autor:in) / Du, Qifeng (Autor:in) / Ai, Jun (Autor:in)
Applied surface science ; 353 ; 1150-1155
01.01.2015
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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