Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process
Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process
Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process
Chen, S. T. (Autor:in) / Liu, Y. Y. (Autor:in) / Chen, G. S. (Autor:in)
APPLIED SURFACE SCIENCE ; 354 ; 144-147
01.01.2015
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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