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Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process
Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process
Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process
Chen, S. T. (author) / Liu, Y. Y. (author) / Chen, G. S. (author)
APPLIED SURFACE SCIENCE ; 354 ; 144-147
2015-01-01
4 pages
Article (Journal)
English
DDC:
621.35
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