Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect
Kao, L. C. (Autor:in) / Hsu, L. H. (Autor:in) / Brahma, S. (Autor:in) / Huang, B. C. (Autor:in) / Liu, C. C. (Autor:in) / Lo, K. Y. (Autor:in)
APPLIED SURFACE SCIENCE ; 388 ; 228-233
01.01.2016
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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