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Texture of Electroplated Copper Film under Biaxial Stress
Texture of Electroplated Copper Film under Biaxial Stress
Texture of Electroplated Copper Film under Biaxial Stress
Hong, B. (Autor:in) / Jiang, C.-h. (Autor:in) / Wang, X.-j. (Autor:in)
MATERIALS TRANSACTIONS ; 47 ; 2299-2301
01.01.2006
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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