A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect
Kao, L. C. (author) / Hsu, L. H. (author) / Brahma, S. (author) / Huang, B. C. (author) / Liu, C. C. (author) / Lo, K. Y. (author)
APPLIED SURFACE SCIENCE ; 388 ; 228-233
2016-01-01
6 pages
Article (Journal)
English
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Densely packed rectangulations
| British Library Online Contents | 1998
Densely packed rectangulations
| Online Contents | 1998
Grain boundary character distribution in electroplated nanotwinned copper
| British Library Online Contents | 2017
Texture of Electroplated Copper Film under Biaxial Stress
| British Library Online Contents | 2006
Grain growth, stress, and impurities in electroplated copper
| British Library Online Contents | 2002