Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure'': Fid-Bau Portal

Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''

Nakamoto, Masashi / Fukuda, Atsushi / Pinkham, Jenna / Vilakazi, Siboniso / Goto, Hiroki / Matsumoto, Ryo / Utsunomiya, Hiroshi / Tanaka, Toshihiro

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''

Nakamoto, Masashi / Fukuda, Atsushi / Pinkham, Jenna / Vilakazi, Siboniso / Goto, Hiroki / Matsumoto, Ryo / Utsunomiya, Hiroshi / Tanaka, Toshihiro

Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''

Nakamoto, Masashi / Fukuda, Atsushi / Pinkham, Jenna / Vilakazi, Siboniso / Goto, Hiroki / Matsumoto, Ryo / Utsunomiya, Hiroshi / Tanaka, Toshihiro

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''

Beteiligte:

Nakamoto, Masashi (Autor:in) / Fukuda, Atsushi (Autor:in) / Pinkham, Jenna (Autor:in) / Vilakazi, Siboniso (Autor:in) / Goto, Hiroki (Autor:in) / Matsumoto, Ryo (Autor:in) / Utsunomiya, Hiroshi (Autor:in) / Tanaka, Toshihiro (Autor:in)

Erschienen in:

Materials transactions ; 57 ; 973-977

Erscheinungsdatum:

01.01.2016

Format / Umfang:

5 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1105

Fukuda, Atsushi / Matsukawa, Hiroyuki / Goto, Hiroki et al. | British Library Online Contents | 2015

Joining of Metals by Super-Spread Wetting on Surface Fine Crevice Structure Created by Reduction-Sintering Copper Oxide Powder

Yeon, Jaebong / Ishida, Yuya / Nakamoto, Masashi et al. | British Library Online Contents | 2018

Mechanism of the Unusual Wetting of a Surface Fine Crevice Structure Created by Laser Irradiation

Siboniso, Vilakazi / Yeon, Jaebong / Grozescu, Christian et al. | British Library Online Contents | 2017

Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

Satyanarayan / Prabhu, K.N. | British Library Online Contents | 2012

Metal—Metal Joining Using Super-Spread Wetting into Interface Fine Mesh Structure

Yeon, Jaebong / Yen, Yen-Man / Nakamoto, Masashi et al. | British Library Online Contents | 2018

Nach oben