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Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''
Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''
Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin—Lead Solder on ``Surface Fine Crevice Structure''
Nakamoto, Masashi (author) / Fukuda, Atsushi (author) / Pinkham, Jenna (author) / Vilakazi, Siboniso (author) / Goto, Hiroki (author) / Matsumoto, Ryo (author) / Utsunomiya, Hiroshi (author) / Tanaka, Toshihiro (author)
Materials transactions ; 57 ; 973-977
2016-01-01
5 pages
Article (Journal)
English
DDC:
620.1105
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