Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper
Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper
Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper
Miyajima, Yoji (Autor:in) / Uchiyama, Midori (Autor:in) / Adachi, Hiroki (Autor:in) / Fujii, Toshiyuki (Autor:in) / Onaka, Susumu (Autor:in) / Kato, Masaharu (Autor:in)
Materials transactions ; 57 ; 1411-1417
01.01.2016
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2007
|British Library Online Contents | 2014
|British Library Online Contents | 2010
|Microstructure Evolution during the Accumulative Roll Bonding Process in Armco Iron
British Library Online Contents | 2012
|Role of trace elements on tensile behavior of accumulative roll-bonded pure copper
British Library Online Contents | 2005
|