Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Best of Track of Symposium — Wire Bonding Wire Bonding Looping Solutions for High Density System-in-Package (SiP)
Best of Track of Symposium — Wire Bonding Wire Bonding Looping Solutions for High Density System-in-Package (SiP)
Best of Track of Symposium — Wire Bonding Wire Bonding Looping Solutions for High Density System-in-Package (SiP)
Milton, Basil (Autor:in) / Kwon, Odal (Autor:in) / Huynh, Cuong (Autor:in) / Qin, Ivy (Autor:in) / Chylak, Bob (Autor:in)
Advancing microelectronics ; 45 ; 14-19
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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