Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
Akbari, Saeed (Autor:in) / Nourani, Amir (Autor:in) / Spelt, Jan K. (Autor:in)
Composites.Part A, Applied science and manufacturing ; 87 ; 228-236
01.01.2016
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11805
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