Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw
Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw
Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw
Wang, Peizhi (Autor:in) / Ge, Peiqi (Autor:in) / Gao, Yufei (Autor:in) / Bi, Wenbo (Autor:in)
Materials science in semiconductor processing ; 63 ; 25-32
01.01.2017
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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