Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
Liu, Tingting (Autor:in) / Lei, Hong (Autor:in)
Applied surface science ; 413 ; 16-26
01.01.2017
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2017
|Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives
British Library Online Contents | 2009
|Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives
British Library Online Contents | 2008
|Machining Mechanisms of Si Wafers in Mechanochemical Polishing by Soft Abrasives
British Library Online Contents | 2005
|Effects of mixed abrasives in chemical mechanical polishing of oxide films
British Library Online Contents | 2003
|