Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Xiang, Jing (Autor:in) / Wang, Chong (Autor:in) / Chen, Yuanming (Autor:in) / Wang, Shouxu (Autor:in) / Hong, Yan (Autor:in) / Zhang, Huaiwu (Autor:in) / Gong, Lijun (Autor:in) / He, Wei (Autor:in)
Applied surface science ; 411 ; 82-90
01.01.2017
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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