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Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Xiang, Jing (author) / Wang, Chong (author) / Chen, Yuanming (author) / Wang, Shouxu (author) / Hong, Yan (author) / Zhang, Huaiwu (author) / Gong, Lijun (author) / He, Wei (author)
Applied surface science ; 411 ; 82-90
2017-01-01
9 pages
Article (Journal)
English
DDC:
620.44
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