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Improving sidewall roughness by combined RIE-Bosch process
Improving sidewall roughness by combined RIE-Bosch process
Improving sidewall roughness by combined RIE-Bosch process
Fu, Jianyu (Autor:in) / Li, Junjie (Autor:in) / Yu, Jiahan (Autor:in) / Liu, Ruiwen (Autor:in) / Li, Junfeng (Autor:in) / Wang, Weibing (Autor:in) / Wang, Wenwu (Autor:in) / Chen, Dapeng (Autor:in)
Materials science in semiconductor processing ; 83 ; 186-191
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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