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A platform for research: civil engineering, architecture and urbanism
Improving sidewall roughness by combined RIE-Bosch process
Improving sidewall roughness by combined RIE-Bosch process
Improving sidewall roughness by combined RIE-Bosch process
Fu, Jianyu (author) / Li, Junjie (author) / Yu, Jiahan (author) / Liu, Ruiwen (author) / Li, Junfeng (author) / Wang, Weibing (author) / Wang, Wenwu (author) / Chen, Dapeng (author)
Materials science in semiconductor processing ; 83 ; 186-191
2018-01-01
6 pages
Article (Journal)
English
DDC:
621.38152
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