Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
Huang, Z. (Autor:in) / Kumar, P. (Autor:in) / Dutta, I. (Autor:in) / Pang, J.H.L. (Autor:in) / Sidhu, R. (Autor:in)
Engineering fracture mechanics ; 131 ; 9-25
01.01.2014
17 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.112605
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