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A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
Huang, Z. (author) / Kumar, P. (author) / Dutta, I. (author) / Pang, J.H.L. (author) / Sidhu, R. (author)
Engineering fracture mechanics ; 131 ; 9-25
2014-01-01
17 pages
Article (Journal)
English
DDC:
620.112605
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