Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
Gao, Li-Yin (Autor:in) / Zhang, Hao (Autor:in) / Li, Cai-Fu (Autor:in) / Guo, Jingdong (Autor:in) / Liu, Zhi-Quan (Autor:in)
Journal of materials science & technology ; 34 ; 1305-1314
01.01.2018
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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