Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Design for Reliability Package and board-level reliability with CAE
Design for Reliability Package and board-level reliability with CAE
Design for Reliability Package and board-level reliability with CAE
Tee, T. Y. (Autor:in)
ADVANCED PACKAGING ; 11 ; 33-36
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Vibration Reliability in Flip Chip Package
| British Library Online Contents | 2005
Flip Chip PBGAs Board-level Reliability and Testing
| British Library Online Contents | 2003
Board-level Reliability Design A Close Look at 0.5 mm Pitch CSPs
| British Library Online Contents | 2003
Flip Chip PBGAs Assess FPBGA Package Reliability
| British Library Online Contents | 2003
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
| British Library Online Contents | 2018