Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce, Ga) alloy filler and Si substrate: Fid-Bau Portal

Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce, Ga) alloy filler and Si substrate

Cheng, L.X. / Li, G.Y. / Wang, X.Q. / Li, Z.L. / Wu, Z.Z.

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Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce, Ga) alloy filler and Si substrate

Cheng, L.X. / Li, G.Y. / Wang, X.Q. / Li, Z.L. / Wu, Z.Z.

Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce, Ga) alloy filler and Si substrate

Cheng, L.X. / Li, G.Y. / Wang, X.Q. / Li, Z.L. / Wu, Z.Z.

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Titel:

Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce, Ga) alloy filler and Si substrate

Beteiligte:

Cheng, L.X. (Autor:in) / Li, G.Y. (Autor:in) / Wang, X.Q. (Autor:in) / Li, Z.L. (Autor:in) / Wu, Z.Z. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING A ; 658 ; 42-49

Erscheinungsdatum:

01.01.2016

Format / Umfang:

8 pages

ISSN:

0921-5093

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Unbekannt

Cheng, L.X. / Li, G.Y. / Wang, X.Q. et al. | British Library Online Contents | 2016

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Yu, C.-H. / Lin, K.-L. | British Library Online Contents | 2005

Active soldering of aluminum—graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler

Tsao, L.-C. / Hsieh, M.-J. / Chen, T.-Y. et al. | British Library Online Contents | 2016

Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

Cheng, L.X. / Liu, M.R. / Wang, X.Q. et al. | British Library Online Contents | 2017

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