Interfacial Reaction between SnAgCu Solder and Cu Substrate and Reliability Evaluation

Yanghua, X. / Xiaming, X. / Junling, C. | British Library Online Contents | 2005

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2006

Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

Takaku, Y. / Liu, X. J. / Ohnuma, I. et al. | British Library Online Contents | 2004

Dissolution and reaction between Au and molten eutectic PbSn solder

Lee, T. K. / Zhang, S. / Wong, C. C. et al. | British Library Online Contents | 2006