Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Crack on a chip test method for thin freestanding films
Crack on a chip test method for thin freestanding films
Crack on a chip test method for thin freestanding films
Jaddi, S. (Autor:in) / Coulombier, M. (Autor:in) / Raskin, J.-P. (Autor:in) / Pardoen, T. (Autor:in)
Journal of the mechanics and physics of solids ; 123 ; 267-291
01.01.2019
25 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
531.05
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