Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Corrigendum to: "Representative volume element analysis for wafer-level warpage using Finite Element methods" [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
Corrigendum to: "Representative volume element analysis for wafer-level warpage using Finite Element methods" [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
Corrigendum to: "Representative volume element analysis for wafer-level warpage using Finite Element methods" [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
Baek, Jong Won (Autor:in) / Yang, Woo Seok (Autor:in) / Hur, Min Jae (Autor:in) / Yun, Jin Chul (Autor:in) / Park, Seong Jin (Autor:in)
Materials science in semiconductor processing ; 93 ; 379-380
01.01.2019
2 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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Representative volume element analysis for wafer-level warpage using Finite Element methods
| British Library Online Contents | 2019
| British Library Conference Proceedings | 1999