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Corrigendum to: "Representative volume element analysis for wafer-level warpage using Finite Element methods" [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
Corrigendum to: "Representative volume element analysis for wafer-level warpage using Finite Element methods" [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
Corrigendum to: "Representative volume element analysis for wafer-level warpage using Finite Element methods" [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
Baek, Jong Won (author) / Yang, Woo Seok (author) / Hur, Min Jae (author) / Yun, Jin Chul (author) / Park, Seong Jin (author)
Materials science in semiconductor processing ; 93 ; 379-380
2019-01-01
2 pages
Article (Journal)
English
DDC:
621.38152
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Representative volume element analysis for wafer-level warpage using Finite Element methods
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