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Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Highlights Fe2NiO4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. The intermetallics compound reduced with the addition of nanoparticles into solder paste. The hardness increased with the addition of limited percentage of nanoparticles into SAC 305.
Abstract This study investigates the effects of the addition of Fe2NiO4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5wt.% of Fe2NiO4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5wt.% of Fe2NiO4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5wt.% of Fe2NiO4 nanoparticles, respectively. If the addition of Fe2NiO4 nanoparticle exceeded 1.5wt.%, the hardness increased infinitely.
Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Highlights Fe2NiO4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. The intermetallics compound reduced with the addition of nanoparticles into solder paste. The hardness increased with the addition of limited percentage of nanoparticles into SAC 305.
Abstract This study investigates the effects of the addition of Fe2NiO4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5wt.% of Fe2NiO4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5wt.% of Fe2NiO4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5wt.% of Fe2NiO4 nanoparticles, respectively. If the addition of Fe2NiO4 nanoparticle exceeded 1.5wt.%, the hardness increased infinitely.
Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Chellvarajoo, Srivalli (Autor:in) / Abdullah, M.Z. (Autor:in) / Samsudin, Z. (Autor:in)
20.11.2014
12 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
A Green Approach to Synthesis of Nanoparticles of Sn-3.0Ag-0.5Cu Lead-Free Solder Alloy
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