Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Bonding clay used for kiln refractory bricks, and preparation process thereof
The invention discloses bonding clay used for kiln refractory bricks, and a preparation process thereof. The bonding clay is mainly prepared through the steps that kaolin, alumina powder, black clay and water glass are mixed, and that the mixture is ball-milled and stirred. In the raw materials, the particle sizes of kaolin, alumina powder and black clay are all smaller than 50mu m, such that a firing temperature is relatively low. With a reasonable formulation described in the technical scheme, the molar ratio of the high-temperature components SiO2 to Al2O3 in the bonding clay is controlled within a range of 8-10; the weights of MgO, CaO, BaO, B2O3, K20 and Na20 with high fusibility promotion properties are increased; and in the bonding clay, particles with sizes smaller than 20mu m account for more than 50%. Compared to prior arts, the bonding clay provided by the invention can be fired under a relatively low temperature (1150 DEG C), such that energy can be saved, and consumption can be reduced.
Bonding clay used for kiln refractory bricks, and preparation process thereof
The invention discloses bonding clay used for kiln refractory bricks, and a preparation process thereof. The bonding clay is mainly prepared through the steps that kaolin, alumina powder, black clay and water glass are mixed, and that the mixture is ball-milled and stirred. In the raw materials, the particle sizes of kaolin, alumina powder and black clay are all smaller than 50mu m, such that a firing temperature is relatively low. With a reasonable formulation described in the technical scheme, the molar ratio of the high-temperature components SiO2 to Al2O3 in the bonding clay is controlled within a range of 8-10; the weights of MgO, CaO, BaO, B2O3, K20 and Na20 with high fusibility promotion properties are increased; and in the bonding clay, particles with sizes smaller than 20mu m account for more than 50%. Compared to prior arts, the bonding clay provided by the invention can be fired under a relatively low temperature (1150 DEG C), such that energy can be saved, and consumption can be reduced.
Bonding clay used for kiln refractory bricks, and preparation process thereof
WEN HAISHENG (Autor:in)
15.07.2015
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
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