Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Insulating substrate having through-hole
Provided is an insulating substrate (1) in which through-holes (2) for conductors are arranged. The insulating substrate (1) measures 25-100 [mu]m in thickness and the through holes (2) measure 20-100 [mu]m in diameter. The insulating substrate (1) is provided with a body portion (5) and exposed regions (4) exposed via the through-holes (2). The insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or higher and a purity of 99.9% or higher. Particles (5a) of the alumina sintered compact constituting the main body portion (5) have an average particle diameter of 3-6 [mu]m. Alumina particles constituting the alumina sintered compact in the exposed regions (4) describe the shape of a plate. The plate-shaped alumina particles (4a) have an average length of 8-25 [mu]m.
Insulating substrate having through-hole
Provided is an insulating substrate (1) in which through-holes (2) for conductors are arranged. The insulating substrate (1) measures 25-100 [mu]m in thickness and the through holes (2) measure 20-100 [mu]m in diameter. The insulating substrate (1) is provided with a body portion (5) and exposed regions (4) exposed via the through-holes (2). The insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or higher and a purity of 99.9% or higher. Particles (5a) of the alumina sintered compact constituting the main body portion (5) have an average particle diameter of 3-6 [mu]m. Alumina particles constituting the alumina sintered compact in the exposed regions (4) describe the shape of a plate. The plate-shaped alumina particles (4a) have an average length of 8-25 [mu]m.
Insulating substrate having through-hole
TAKAGAKI TATSURO (Autor:in) / IWASAKI YASUNORI (Autor:in) / MIYAZAWA SUGIO (Autor:in) / IDE AKIYOSHI (Autor:in) / NAKANISHI HIROKAZU (Autor:in)
09.12.2015
Patent
Elektronische Ressource
Englisch