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Insulating substrate having through-hole
Provided is an insulating substrate (1) in which through-holes (2) for conductors are arranged. The insulating substrate (1) measures 25-100 [mu]m in thickness and the through holes (2) measure 20-100 [mu]m in diameter. The insulating substrate (1) is provided with a body portion (5) and exposed regions (4) exposed via the through-holes (2). The insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or higher and a purity of 99.9% or higher. Particles (5a) of the alumina sintered compact constituting the main body portion (5) have an average particle diameter of 3-6 [mu]m. Alumina particles constituting the alumina sintered compact in the exposed regions (4) describe the shape of a plate. The plate-shaped alumina particles (4a) have an average length of 8-25 [mu]m.
Insulating substrate having through-hole
Provided is an insulating substrate (1) in which through-holes (2) for conductors are arranged. The insulating substrate (1) measures 25-100 [mu]m in thickness and the through holes (2) measure 20-100 [mu]m in diameter. The insulating substrate (1) is provided with a body portion (5) and exposed regions (4) exposed via the through-holes (2). The insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or higher and a purity of 99.9% or higher. Particles (5a) of the alumina sintered compact constituting the main body portion (5) have an average particle diameter of 3-6 [mu]m. Alumina particles constituting the alumina sintered compact in the exposed regions (4) describe the shape of a plate. The plate-shaped alumina particles (4a) have an average length of 8-25 [mu]m.
Insulating substrate having through-hole
TAKAGAKI TATSURO (author) / IWASAKI YASUNORI (author) / MIYAZAWA SUGIO (author) / IDE AKIYOSHI (author) / NAKANISHI HIROKAZU (author)
2015-12-09
Patent
Electronic Resource
English