Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Insulating substrate having through-holes
Provided is an insulating substrate (1) on which through-holes (2) for a conductor are arranged. The insulating substrate (1) measures 25-300 [mu]m in thickness, the through-holes (2) measure 20-100 [mu]m in diameter (W), and the insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or above and an average particle diameter of 2-50 [mu]m.
Insulating substrate having through-holes
Provided is an insulating substrate (1) on which through-holes (2) for a conductor are arranged. The insulating substrate (1) measures 25-300 [mu]m in thickness, the through-holes (2) measure 20-100 [mu]m in diameter (W), and the insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or above and an average particle diameter of 2-50 [mu]m.
Insulating substrate having through-holes
TAKAGAKI TATSURO (Autor:in) / IWASAKI YASUNORI (Autor:in) / MIYAZAWA SUGIO (Autor:in) / IDE AKIYOSHI (Autor:in) / NAKANISHI HIROKAZU (Autor:in)
23.12.2015
Patent
Elektronische Ressource
Englisch