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Insulating substrate having through-holes
Provided is an insulating substrate (1) on which through-holes (2) for a conductor are arranged. The insulating substrate (1) measures 25-300 [mu]m in thickness, the through-holes (2) measure 20-100 [mu]m in diameter (W), and the insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or above and an average particle diameter of 2-50 [mu]m.
Insulating substrate having through-holes
Provided is an insulating substrate (1) on which through-holes (2) for a conductor are arranged. The insulating substrate (1) measures 25-300 [mu]m in thickness, the through-holes (2) measure 20-100 [mu]m in diameter (W), and the insulating substrate (1) comprises an alumina sintered compact. The alumina sintered compact has a relative density of 99.5% or above and an average particle diameter of 2-50 [mu]m.
Insulating substrate having through-holes
TAKAGAKI TATSURO (author) / IWASAKI YASUNORI (author) / MIYAZAWA SUGIO (author) / IDE AKIYOSHI (author) / NAKANISHI HIROKAZU (author)
2015-12-23
Patent
Electronic Resource
English