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Composite aluminum-based LED printed circuit board and preparation method thereof
The invention relates to the field of circuit board manufacturing, and particularly discloses a composite aluminum-based LED printed circuit board and a preparation method thereof. A composite aluminum-based LED printed circuit board comprises a composite aluminum base material substrate and a copper foil bonded on the composite aluminum base material substrate, and the composite aluminum base material substrate comprises the following raw materials by weight: 50-70 parts of modified aluminum powder; 20 to 25 parts of polytetrafluoroethylene; 20 to 30 parts of polyimide; 10 to 15 parts of silicate fiber; 15 to 25 parts of silicon nitride powder; 5 to 10 parts of an antioxidant; and 30-40 parts of water. The circuit board provided by the invention has good thermal conductivity and excellent electrical insulativity, and an additional insulating layer does not need to be arranged on the composite aluminum base material substrate, so that the composite aluminum base material substrate has the characteristics of being light and thin, and the composite aluminum base material substrate has wide applicability when being used as the circuit board; meanwhile, the structure of the circuit board is effectively simplified, and the production cost of the circuit board is reduced.
本申请涉及电路板制造的领域,具体公开了一种复合铝基LED印制电路板及其制备方法。一种复合铝基LED印制电路板,包括复合铝基材基板和粘结于复合铝基材基板上的铜箔,所述复合铝基材基板包括如下重量份的原料:改性铝粉50‑70份;聚四氟乙烯20‑25份;聚酰亚胺20‑30份;硅酸盐纤维10‑15份;氮化硅粉15‑25份;抗氧剂5‑10份;水30‑40份。本申请的电路板具有有良好的导热性的同时具有优异的电绝缘性无需在复合铝基材基板上设置额外的绝缘层,从而使复合铝基材基板具有轻薄的特性,使得复合铝基材基板作为电路板使用具有广泛的适用性,同时有效简化了电路板的结构,有利于降低电路板的生产成本。
Composite aluminum-based LED printed circuit board and preparation method thereof
The invention relates to the field of circuit board manufacturing, and particularly discloses a composite aluminum-based LED printed circuit board and a preparation method thereof. A composite aluminum-based LED printed circuit board comprises a composite aluminum base material substrate and a copper foil bonded on the composite aluminum base material substrate, and the composite aluminum base material substrate comprises the following raw materials by weight: 50-70 parts of modified aluminum powder; 20 to 25 parts of polytetrafluoroethylene; 20 to 30 parts of polyimide; 10 to 15 parts of silicate fiber; 15 to 25 parts of silicon nitride powder; 5 to 10 parts of an antioxidant; and 30-40 parts of water. The circuit board provided by the invention has good thermal conductivity and excellent electrical insulativity, and an additional insulating layer does not need to be arranged on the composite aluminum base material substrate, so that the composite aluminum base material substrate has the characteristics of being light and thin, and the composite aluminum base material substrate has wide applicability when being used as the circuit board; meanwhile, the structure of the circuit board is effectively simplified, and the production cost of the circuit board is reduced.
本申请涉及电路板制造的领域,具体公开了一种复合铝基LED印制电路板及其制备方法。一种复合铝基LED印制电路板,包括复合铝基材基板和粘结于复合铝基材基板上的铜箔,所述复合铝基材基板包括如下重量份的原料:改性铝粉50‑70份;聚四氟乙烯20‑25份;聚酰亚胺20‑30份;硅酸盐纤维10‑15份;氮化硅粉15‑25份;抗氧剂5‑10份;水30‑40份。本申请的电路板具有有良好的导热性的同时具有优异的电绝缘性无需在复合铝基材基板上设置额外的绝缘层,从而使复合铝基材基板具有轻薄的特性,使得复合铝基材基板作为电路板使用具有广泛的适用性,同时有效简化了电路板的结构,有利于降低电路板的生产成本。
Composite aluminum-based LED printed circuit board and preparation method thereof
一种复合铝基LED印制电路板及其制备方法
FANG CHUANHAI (Autor:in) / ZHANG JINGCHENG (Autor:in) / BAO LIYONG (Autor:in) / FANG DAN (Autor:in)
24.11.2023
Patent
Elektronische Ressource
Chinesisch
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