Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Aluminum nitride ceramic substrate surface treatment method
The invention relates to an aluminum nitride ceramic substrate surface treatment method which comprises the following steps: 1) pretreatment: removing oil stains and impurities on the surface of a substrate, soaking the substrate in an organic solvent solution, and taking out and drying the substrate after treatment; and (2) interface coupling agent treatment: immersing the aluminum nitride ceramic substrate treated in the step (1) in a mixed solution of an interface coupling agent and absolute ethyl alcohol for normal-temperature treatment for 5-10 minutes, then taking out and drying the aluminum nitride ceramic substrate, wherein the volume ratio of the interface coupling agent to the absolute ethyl alcohol is 1: (100-200). According to the method, chemical modification is carried out onthe ceramic surface, the adhesiveness of the solder can be improved, the chemical bonding force between the solder layer and the ceramic surface is remarkably improved, therefore, holes and gaps of the solder bonding layer are reduced, the thermal shock resistance of the copper-clad plate is improved, the treatment efficiency is high, and the cost is low. And the method can be used on the basis of coarsening the surface of the ceramic, so that the adhesiveness of the active metal solder is further improved.
本发明涉及一种氮化铝陶瓷基板表面处理方法，包括如下工序：1)前处理：去除基板表面的油污和杂质后，将其浸没于有机溶剂液中，处理后取出烘干；2)界面偶联剂处理：将经步骤1)处理后的氮化铝陶瓷基板浸没于界面偶联剂和无水乙醇的混合溶液中常温处理5～10min，而后取出烘干，界面偶联剂和无水乙醇的体积比为1:100～200。本发明中的方法针对陶瓷表面进行化学改性，可改善焊料的附着性，显著提高焊料层与陶瓷表面的化学结合力从而减少焊料结合层的空洞和空隙，提高覆铜板的抗热冲击性能且处理效率高、成本低。且该方法可在对陶瓷表面进行粗化的基础上使用，进一步提高活性金属焊料附着性。
Aluminum nitride ceramic substrate surface treatment method
The invention relates to an aluminum nitride ceramic substrate surface treatment method which comprises the following steps: 1) pretreatment: removing oil stains and impurities on the surface of a substrate, soaking the substrate in an organic solvent solution, and taking out and drying the substrate after treatment; and (2) interface coupling agent treatment: immersing the aluminum nitride ceramic substrate treated in the step (1) in a mixed solution of an interface coupling agent and absolute ethyl alcohol for normal-temperature treatment for 5-10 minutes, then taking out and drying the aluminum nitride ceramic substrate, wherein the volume ratio of the interface coupling agent to the absolute ethyl alcohol is 1: (100-200). According to the method, chemical modification is carried out onthe ceramic surface, the adhesiveness of the solder can be improved, the chemical bonding force between the solder layer and the ceramic surface is remarkably improved, therefore, holes and gaps of the solder bonding layer are reduced, the thermal shock resistance of the copper-clad plate is improved, the treatment efficiency is high, and the cost is low. And the method can be used on the basis of coarsening the surface of the ceramic, so that the adhesiveness of the active metal solder is further improved.
本发明涉及一种氮化铝陶瓷基板表面处理方法，包括如下工序：1)前处理：去除基板表面的油污和杂质后，将其浸没于有机溶剂液中，处理后取出烘干；2)界面偶联剂处理：将经步骤1)处理后的氮化铝陶瓷基板浸没于界面偶联剂和无水乙醇的混合溶液中常温处理5～10min，而后取出烘干，界面偶联剂和无水乙醇的体积比为1:100～200。本发明中的方法针对陶瓷表面进行化学改性，可改善焊料的附着性，显著提高焊料层与陶瓷表面的化学结合力从而减少焊料结合层的空洞和空隙，提高覆铜板的抗热冲击性能且处理效率高、成本低。且该方法可在对陶瓷表面进行粗化的基础上使用，进一步提高活性金属焊料附着性。
Aluminum nitride ceramic substrate surface treatment method
一种氮化铝陶瓷基板表面处理方法
WANG BIN (Autor:in) / HE XIANHAN (Autor:in) / SUN QUAN (Autor:in) / OUYANG PENG (Autor:in) / GE ZHUANG (Autor:in)
18.08.2020
Patent
Elektronische Ressource
Chinesisch
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