Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Light partition board mounting structure and mounting method
The invention relates to the technical field of housing construction, in particular to a light partition board mounting structure and a mounting method. The light partition board mounting structure comprises a light partition board, a structural beam located on the top of the light partition board and a structural bottom plate located at the bottom of the light partition board. An elastic part isfurther arranged between the light partition board and the structural beam, and the elastic part is pressed between the light partition board and the structural beam. The mounting method of the lightpartition board mounting structure comprises the following steps of S1, mounting the light partition board and the elastic part between the structural beam and the structural bottom plate in positionand cushioning the bottom of the light partition board with a wedge block; S2, mounting a U-shaped clip on the top of the light partition wall; S3, filling the bottom of the light partition board withcement mortar; S4, taking out the wedge block after the cement mortar is frozen to designed strength, and filling the wedge block continuously with cement mortar; and S5, filling the space between the top of the light partition board and the structural beam with bonding mortar after the cement mortar is frozen to designed strength.
本发明涉及房屋建筑施工技术领域，具体涉及一种轻质隔墙板安装结构及安装方法，其中，轻质隔墙板安装结构包括轻质隔墙板、位于其顶部的结构梁以及位于其底部的结构底板，轻质隔墙板与结构梁之间还设有弹性件，弹性件在轻质隔墙板与结构梁之间受压；轻质隔墙板安装方法包括以下步骤：步骤一：将轻质隔墙板及弹性件在结构梁与结构底板之间安装到位，将轻质隔墙板的底部用楔块垫实；步骤二：在轻质隔墙板顶部安装U型卡；步骤三：在轻质隔墙板底部充填水泥砂浆；步骤四：待水泥砂浆凝固至达到设计强度后，取出楔块，并继续用水泥砂浆填补；步骤五：待水泥砂浆凝固至达到设计强度后，在轻质隔墙板顶部与结构梁之间填充粘接砂浆。
Light partition board mounting structure and mounting method
The invention relates to the technical field of housing construction, in particular to a light partition board mounting structure and a mounting method. The light partition board mounting structure comprises a light partition board, a structural beam located on the top of the light partition board and a structural bottom plate located at the bottom of the light partition board. An elastic part isfurther arranged between the light partition board and the structural beam, and the elastic part is pressed between the light partition board and the structural beam. The mounting method of the lightpartition board mounting structure comprises the following steps of S1, mounting the light partition board and the elastic part between the structural beam and the structural bottom plate in positionand cushioning the bottom of the light partition board with a wedge block; S2, mounting a U-shaped clip on the top of the light partition wall; S3, filling the bottom of the light partition board withcement mortar; S4, taking out the wedge block after the cement mortar is frozen to designed strength, and filling the wedge block continuously with cement mortar; and S5, filling the space between the top of the light partition board and the structural beam with bonding mortar after the cement mortar is frozen to designed strength.
本发明涉及房屋建筑施工技术领域，具体涉及一种轻质隔墙板安装结构及安装方法，其中，轻质隔墙板安装结构包括轻质隔墙板、位于其顶部的结构梁以及位于其底部的结构底板，轻质隔墙板与结构梁之间还设有弹性件，弹性件在轻质隔墙板与结构梁之间受压；轻质隔墙板安装方法包括以下步骤：步骤一：将轻质隔墙板及弹性件在结构梁与结构底板之间安装到位，将轻质隔墙板的底部用楔块垫实；步骤二：在轻质隔墙板顶部安装U型卡；步骤三：在轻质隔墙板底部充填水泥砂浆；步骤四：待水泥砂浆凝固至达到设计强度后，取出楔块，并继续用水泥砂浆填补；步骤五：待水泥砂浆凝固至达到设计强度后，在轻质隔墙板顶部与结构梁之间填充粘接砂浆。
Light partition board mounting structure and mounting method
一种轻质隔墙板安装结构及安装方法
YANG HONGXUN (Autor:in) / YANG JUNDONG (Autor:in) / ZENG YONGLIN (Autor:in) / WU YONGCHUN (Autor:in)
02.10.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
Prefabricated light partition board mounting device and mounting method
| Europäisches Patentamt | 2022
Connecting structure for light partition board mounting
| Europäisches Patentamt | 2020
Mounting method of ultrahigh light partition board structure
| Europäisches Patentamt | 2024