Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Silver plating process of resistance ceramic for 5G communication and ceramic chip
The invention relates to the field of electroplating processes, and particularly discloses a silver plating process of a resistance ceramic for 5G communication and a ceramic chip. The silver platingprocess of the resistance ceramic for 5G communication comprises the following steps that 1, feeding operation is conducted; 2, nickel plating is conducted, specifically, the electroplating roller containing the ceramic chip is immersed in a nickel-containing electroplating solution, sulfur-containing nickel serves as an anode, the ceramic chip serves as a cathode, and the electroplating solutioncomprises nickel aminosulfonate, nickel chloride and boric acid; 3, silver plating is conducted, specifically, the electroplating roller containing the ceramic chip is immersed in an electroplating solution containing silver to be electroplated, the concentration of Ag in the electrolyte is 820 g/L, and the concentration of KCN in the electrolyte is 100150 g/L. The method has the advantage that the possibility that the appearance and the performance of the product are influenced due to uneven surface and low smoothness of the product caused by corrosion of the product in the plating solution in the silver plating process can be reduced.
本申请涉及电镀工艺领域，具体公开了一种5G通讯用电阻陶瓷镀银工艺及陶瓷片。5G通讯用电阻陶瓷镀银工艺包括以下步骤：步骤一、上料；步骤二、镀镍，将装有陶瓷片的电镀滚筒浸入含镍的电镀液中，以含硫镍作为阳极，陶瓷片作为阴极，电镀液包括氨基磺酸镍、氯化镍和硼酸；步骤三、镀银，将装有陶瓷片的电镀滚筒浸入含银的电镀液中电镀，其中，电解液中Ag浓度为8‑20g/L，KCN浓度为100‑150g/L。其具有能减小镀银过程中，产品在镀液中受腐蚀，造成产品表面不平、光滑度低，从而影响产品的外观和性能的可能性优点。
Silver plating process of resistance ceramic for 5G communication and ceramic chip
The invention relates to the field of electroplating processes, and particularly discloses a silver plating process of a resistance ceramic for 5G communication and a ceramic chip. The silver platingprocess of the resistance ceramic for 5G communication comprises the following steps that 1, feeding operation is conducted; 2, nickel plating is conducted, specifically, the electroplating roller containing the ceramic chip is immersed in a nickel-containing electroplating solution, sulfur-containing nickel serves as an anode, the ceramic chip serves as a cathode, and the electroplating solutioncomprises nickel aminosulfonate, nickel chloride and boric acid; 3, silver plating is conducted, specifically, the electroplating roller containing the ceramic chip is immersed in an electroplating solution containing silver to be electroplated, the concentration of Ag in the electrolyte is 820 g/L, and the concentration of KCN in the electrolyte is 100150 g/L. The method has the advantage that the possibility that the appearance and the performance of the product are influenced due to uneven surface and low smoothness of the product caused by corrosion of the product in the plating solution in the silver plating process can be reduced.
本申请涉及电镀工艺领域，具体公开了一种5G通讯用电阻陶瓷镀银工艺及陶瓷片。5G通讯用电阻陶瓷镀银工艺包括以下步骤：步骤一、上料；步骤二、镀镍，将装有陶瓷片的电镀滚筒浸入含镍的电镀液中，以含硫镍作为阳极，陶瓷片作为阴极，电镀液包括氨基磺酸镍、氯化镍和硼酸；步骤三、镀银，将装有陶瓷片的电镀滚筒浸入含银的电镀液中电镀，其中，电解液中Ag浓度为8‑20g/L，KCN浓度为100‑150g/L。其具有能减小镀银过程中，产品在镀液中受腐蚀，造成产品表面不平、光滑度低，从而影响产品的外观和性能的可能性优点。
Silver plating process of resistance ceramic for 5G communication and ceramic chip
5G通讯用电阻陶瓷镀银工艺及陶瓷片
ZHANG YU (Autor:in) / YU YANGQIANG (Autor:in) / WU JIANDAN (Autor:in) / LIAO MENGLIANG (Autor:in)
01.01.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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