Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate and preparation method thereof
The invention discloses a high-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate and a preparation method thereof. The high-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate is prepared from the following raw materials: 30-80 wt% of inorganic filler; 1-10 wt% of glass fibers; 10-70 wt% of a fluororesin polymer system; 0.1-2.0 wt% of a coupling agent; and 0.1-5.0 wt% of an ester surfactant. The preparation process is simple and environment-friendly, the raw materials are easily available, and industrial production canbe easily realized. The dielectric constant of the composite dielectric substrate prepared by the method is 2.5-6.5, the temperature coefficient of the dielectric constant is between -10 ppm/DEG C and 10 ppm/DEG C, the coefficient of thermal expansion is less than 24 ppm/DEG C, and the thermal conductivity is 1.2 W/mk. The composite dielectric substrate is widely applied to the high-tech fields of communication, radars, satellites, high-speed rails, airplanes, high-end weapons and the like.
本发明公开了一种高导热和高热稳定微波复合介质基板以及制备方法。高导热和高热稳定微波复合介质基板由以下原材料制成：30‑80 wt%的无机填料；1‑10 wt%的玻璃纤维；10‑70 wt%的含氟树脂聚合物体系；0.1‑2.0 wt%的偶联剂；0.1‑5.0 wt%的酯类表面活性剂。本发明的制备工艺简单，环境友好，原料来源方便，有利于实现工业化生产。采用本发明制备的复合介质基板的介电常数为2.5‑6.5，介电常数温度系数在‑10 ppm/℃至10 ppm/℃之间，热膨胀系数小于24 ppm/℃，热导率1.2W/m•k。广泛应用于通讯、雷达、卫星、高铁、飞机以及高尖端武器装备等高科技领域。
High-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate and preparation method thereof
The invention discloses a high-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate and a preparation method thereof. The high-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate is prepared from the following raw materials: 30-80 wt% of inorganic filler; 1-10 wt% of glass fibers; 10-70 wt% of a fluororesin polymer system; 0.1-2.0 wt% of a coupling agent; and 0.1-5.0 wt% of an ester surfactant. The preparation process is simple and environment-friendly, the raw materials are easily available, and industrial production canbe easily realized. The dielectric constant of the composite dielectric substrate prepared by the method is 2.5-6.5, the temperature coefficient of the dielectric constant is between -10 ppm/DEG C and 10 ppm/DEG C, the coefficient of thermal expansion is less than 24 ppm/DEG C, and the thermal conductivity is 1.2 W/mk. The composite dielectric substrate is widely applied to the high-tech fields of communication, radars, satellites, high-speed rails, airplanes, high-end weapons and the like.
本发明公开了一种高导热和高热稳定微波复合介质基板以及制备方法。高导热和高热稳定微波复合介质基板由以下原材料制成：30‑80 wt%的无机填料；1‑10 wt%的玻璃纤维；10‑70 wt%的含氟树脂聚合物体系；0.1‑2.0 wt%的偶联剂；0.1‑5.0 wt%的酯类表面活性剂。本发明的制备工艺简单，环境友好，原料来源方便，有利于实现工业化生产。采用本发明制备的复合介质基板的介电常数为2.5‑6.5，介电常数温度系数在‑10 ppm/℃至10 ppm/℃之间，热膨胀系数小于24 ppm/℃，热导率1.2W/m•k。广泛应用于通讯、雷达、卫星、高铁、飞机以及高尖端武器装备等高科技领域。
High-thermal-conductivity and high-thermal-stability microwave composite dielectric substrate and preparation method thereof
一种高导热和高热稳定微波复合介质基板及其制备方法
WANG LIJING (Autor:in) / LI QIANG (Autor:in) / WU CONG (Autor:in) / ZHANG LIXIN (Autor:in) / JIN XIA (Autor:in) / QIAO YUNHAO (Autor:in) / FENG BEIBEI (Autor:in) / ZHANG HAITAO (Autor:in) / HAN GUIYUN (Autor:in)
02.03.2021
Patent
Elektronische Ressource
Chinesisch
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