Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of ceramic copper-clad plate for high-power LED
The invention relates to the technical field of substrate processes, in particular to a preparation method of a ceramic copper-clad plate for a high-power LED. The preparation method comprises the steps of preparing copper paste; printing and patterning the copper paste on the surface of a ceramic wafer, and baking and forming; and carrying out pre-burning degreasing treatment on the baked and formed ceramic wafer in an oxidizing atmosphere, and then carrying out sintering reduction treatment in a non-oxidizing atmosphere to obtain the ceramic copper-clad plate. The preparation method is simple in process, low in energy consumption, environment-friendly and pollution-free, and has the characteristics of one-step forming and low preparation cost, and the finally obtained ceramic copper-clad plate can be applied to electronic components with high power and high heat dissipation requirements, and has a very good application prospect.
本发明涉及基板工艺技术领域，尤其涉及一种高功率LED用陶瓷覆铜板的制备方法；该制备方法包括如下步骤：配制铜浆；将所述铜浆在陶瓷片表面印刷图形化，烘烤成形；将所述烘烤成形后的陶瓷片在氧化气氛中进行预烧脱脂处理，然后在非氧化气氛中进行烧结还原处理，得到所述陶瓷覆铜板。该制备方法工艺简单，能耗低，环保无污染，且具有一次成型和制备成本低的特点，最终得到的陶瓷覆铜板可以应用于高功率、对散热要求高的电子元器件中，具有很好的应用前景。
Preparation method of ceramic copper-clad plate for high-power LED
The invention relates to the technical field of substrate processes, in particular to a preparation method of a ceramic copper-clad plate for a high-power LED. The preparation method comprises the steps of preparing copper paste; printing and patterning the copper paste on the surface of a ceramic wafer, and baking and forming; and carrying out pre-burning degreasing treatment on the baked and formed ceramic wafer in an oxidizing atmosphere, and then carrying out sintering reduction treatment in a non-oxidizing atmosphere to obtain the ceramic copper-clad plate. The preparation method is simple in process, low in energy consumption, environment-friendly and pollution-free, and has the characteristics of one-step forming and low preparation cost, and the finally obtained ceramic copper-clad plate can be applied to electronic components with high power and high heat dissipation requirements, and has a very good application prospect.
本发明涉及基板工艺技术领域，尤其涉及一种高功率LED用陶瓷覆铜板的制备方法；该制备方法包括如下步骤：配制铜浆；将所述铜浆在陶瓷片表面印刷图形化，烘烤成形；将所述烘烤成形后的陶瓷片在氧化气氛中进行预烧脱脂处理，然后在非氧化气氛中进行烧结还原处理，得到所述陶瓷覆铜板。该制备方法工艺简单，能耗低，环保无污染，且具有一次成型和制备成本低的特点，最终得到的陶瓷覆铜板可以应用于高功率、对散热要求高的电子元器件中，具有很好的应用前景。
Preparation method of ceramic copper-clad plate for high-power LED
一种高功率LED用陶瓷覆铜板的制备方法
LI YONGDONG (Autor:in)
16.07.2021
Patent
Elektronische Ressource
Chinesisch
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