Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-frequency ceramic copper-clad substrate material, preparation method and ceramic copper-clad substrate
The invention discloses a high-frequency ceramic copper-clad substrate material, and relates to the technical field of copper-clad substrate preparation, and the high-frequency ceramic copper-clad substrate material comprises the following components in percentage by weight: 40-60% of x (Ca1-aNd2a/3) TiO3-(1-x) Li0. 5LabSm. 0.5-bTiO3 composite ceramic material, 40-60% of polyimide resin and 0.5-2.0% of silane coupling agent, 0.3 < = x < = 0.4, 0 < = a < = 0.2, 0.2 < = b < = 0.4. The invention further provides a preparation method of the high-frequency ceramic copper-clad substrate material and a ceramic copper-clad substrate. The high-frequency ceramic copper-clad substrate material is excellent in performance, low in dielectric constant, low in dielectric loss, resistant to high temperature and high in metal layer peeling strength, and can meet the application requirements of microwave devices such as antennas, filter devices and high-frequency substrates.
本发明公开了一种高频陶瓷覆铜基板材料，涉及覆铜基板制备技术领域，该高频陶瓷覆铜基板材料包括按重量百分比计的如下组分：x(Ca1‑aNd2a/3)TiO3‑(1‑x)Li0.5LabSm0.5‑bTiO3复合陶瓷材料40‑60％，聚亚酰胺树脂40‑60％，硅烷偶联剂0.5‑2.0％，其中,0.3≤x≤0.4，0≤a≤0.2，0.2≤b≤0.4。本发明还提出了一种高频陶瓷覆铜基板材料的制备方法及陶瓷覆铜基板。本发明的高频陶瓷覆铜基板材料性能优异，降低了介电常数、介电损耗小，耐高温，金属层剥离强度大，可满足天线、滤波器件、高频基板等微波器件应用要求。
High-frequency ceramic copper-clad substrate material, preparation method and ceramic copper-clad substrate
The invention discloses a high-frequency ceramic copper-clad substrate material, and relates to the technical field of copper-clad substrate preparation, and the high-frequency ceramic copper-clad substrate material comprises the following components in percentage by weight: 40-60% of x (Ca1-aNd2a/3) TiO3-(1-x) Li0. 5LabSm. 0.5-bTiO3 composite ceramic material, 40-60% of polyimide resin and 0.5-2.0% of silane coupling agent, 0.3 < = x < = 0.4, 0 < = a < = 0.2, 0.2 < = b < = 0.4. The invention further provides a preparation method of the high-frequency ceramic copper-clad substrate material and a ceramic copper-clad substrate. The high-frequency ceramic copper-clad substrate material is excellent in performance, low in dielectric constant, low in dielectric loss, resistant to high temperature and high in metal layer peeling strength, and can meet the application requirements of microwave devices such as antennas, filter devices and high-frequency substrates.
本发明公开了一种高频陶瓷覆铜基板材料，涉及覆铜基板制备技术领域，该高频陶瓷覆铜基板材料包括按重量百分比计的如下组分：x(Ca1‑aNd2a/3)TiO3‑(1‑x)Li0.5LabSm0.5‑bTiO3复合陶瓷材料40‑60％，聚亚酰胺树脂40‑60％，硅烷偶联剂0.5‑2.0％，其中,0.3≤x≤0.4，0≤a≤0.2，0.2≤b≤0.4。本发明还提出了一种高频陶瓷覆铜基板材料的制备方法及陶瓷覆铜基板。本发明的高频陶瓷覆铜基板材料性能优异，降低了介电常数、介电损耗小，耐高温，金属层剥离强度大，可满足天线、滤波器件、高频基板等微波器件应用要求。
High-frequency ceramic copper-clad substrate material, preparation method and ceramic copper-clad substrate
一种高频陶瓷覆铜基板材料、制备方法及陶瓷覆铜基板
SHAO HUI (Autor:in) / SONG XIADI (Autor:in)
06.02.2024
Patent
Elektronische Ressource
Chinesisch
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