Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Gypsum plaster board and preparation method thereof
The invention provides a gypsum plaster board. The gypsum plaster board comprises a board core and surface protection paper, and the board core is prepared from the raw materials of gypsum clinker, expanded vermiculite, silica fume, a phase change material, a heat conduction reinforcing material, reinforcing fibers and polyvinyl alcohol; and the phase change material and the heat conduction reinforcing material are positioned in an interlayer space of the expanded vermiculite. The gypsum plaster board is good in heat preservation performance, and the phase change material is not prone to leaking.
本申请提供了一种纸面石膏板，包括板芯和护面纸，所述板芯的原料包括石膏熟料、膨胀蛭石、硅灰、相变材料、导热增强材料、增强纤维和聚乙烯醇；所述相变材料和导热增强材料位于所述膨胀蛭石的层间空间内；本申请提供了一种保温性能良好且相变材料不易泄露的石膏板。
Gypsum plaster board and preparation method thereof
The invention provides a gypsum plaster board. The gypsum plaster board comprises a board core and surface protection paper, and the board core is prepared from the raw materials of gypsum clinker, expanded vermiculite, silica fume, a phase change material, a heat conduction reinforcing material, reinforcing fibers and polyvinyl alcohol; and the phase change material and the heat conduction reinforcing material are positioned in an interlayer space of the expanded vermiculite. The gypsum plaster board is good in heat preservation performance, and the phase change material is not prone to leaking.
本申请提供了一种纸面石膏板，包括板芯和护面纸，所述板芯的原料包括石膏熟料、膨胀蛭石、硅灰、相变材料、导热增强材料、增强纤维和聚乙烯醇；所述相变材料和导热增强材料位于所述膨胀蛭石的层间空间内；本申请提供了一种保温性能良好且相变材料不易泄露的石膏板。
Gypsum plaster board and preparation method thereof
一种纸面石膏板及其制备方法
WANG LI (Autor:in) / CHEN HONGXIA (Autor:in) / LIU WENJUN (Autor:in) / RAN XIUYUN (Autor:in)
17.09.2021
Patent
Elektronische Ressource
Chinesisch
Composition for gypsum board, gypsum plaster board and preparation method of gypsum plaster board
| Europäisches Patentamt | 2024