Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Aluminum nitride ceramic composite material for electronic packaging and preparation method thereof
The invention belongs to the technical field of composite materials for electronic packaging, and particularly relates to an aluminum nitride ceramic composite material for electronic packaging and a preparation method thereof.The preparation method comprises the following steps: aluminum nitride powder, aluminum oxide powder and boron nitride powder are mixed, absolute ethyl alcohol is added into the mixed powder, and grinding and heating are conducted to obtain mixed slurry, wherein the grinding time is 20-30 min; the mixed slurry is put into a drying machine for drying, then blocks obtained after drying are ground into powder, and a sintering aid, an adhesive and a plasticizer are added to obtain a mixture; and the mixture is added into a sintering furnace, nitrogen is introduced, and high-temperature sintering is conducted. By making the aluminum nitride coordinated with the aluminum oxide and boron nitride, due to generation of thermal expansion mismatch, a residual stress field is generated, so that the thermal conductivity of the ceramic composite material is improved, the toughness of the ceramic composite material is enhanced, and the strength of the ceramic composite material is effectively improved.
本发明公开的属于电子封装用复合材料技术领域，具体为一种电子封装用氮化铝陶瓷复合材料及制法，包括以下步骤：将氮化铝粉末、三氧化二铝粉末和氮化蹦粉末混合，将混合粉末中加入无水乙醇，研磨并进行加热，得到混合浆料，所述研磨时间为20‑30min，混合浆料放入烘干机中进行烘干，然后将烘干后得到的块状物研磨成粉末状并将加入烧结助剂、粘接剂和增塑剂，得到混合料，将混合料加入烧结炉中通入氮气进行高温烧结，通过将氮化铝与三氧化二铝、氮化蹦进行配合，由于产生热膨胀失配，从而产生残余应力场，提高了陶瓷复合材料的导热率，增强了陶瓷复合材料的韧性，有效的提高了陶瓷复合材料的强度。
Aluminum nitride ceramic composite material for electronic packaging and preparation method thereof
The invention belongs to the technical field of composite materials for electronic packaging, and particularly relates to an aluminum nitride ceramic composite material for electronic packaging and a preparation method thereof.The preparation method comprises the following steps: aluminum nitride powder, aluminum oxide powder and boron nitride powder are mixed, absolute ethyl alcohol is added into the mixed powder, and grinding and heating are conducted to obtain mixed slurry, wherein the grinding time is 20-30 min; the mixed slurry is put into a drying machine for drying, then blocks obtained after drying are ground into powder, and a sintering aid, an adhesive and a plasticizer are added to obtain a mixture; and the mixture is added into a sintering furnace, nitrogen is introduced, and high-temperature sintering is conducted. By making the aluminum nitride coordinated with the aluminum oxide and boron nitride, due to generation of thermal expansion mismatch, a residual stress field is generated, so that the thermal conductivity of the ceramic composite material is improved, the toughness of the ceramic composite material is enhanced, and the strength of the ceramic composite material is effectively improved.
本发明公开的属于电子封装用复合材料技术领域，具体为一种电子封装用氮化铝陶瓷复合材料及制法，包括以下步骤：将氮化铝粉末、三氧化二铝粉末和氮化蹦粉末混合，将混合粉末中加入无水乙醇，研磨并进行加热，得到混合浆料，所述研磨时间为20‑30min，混合浆料放入烘干机中进行烘干，然后将烘干后得到的块状物研磨成粉末状并将加入烧结助剂、粘接剂和增塑剂，得到混合料，将混合料加入烧结炉中通入氮气进行高温烧结，通过将氮化铝与三氧化二铝、氮化蹦进行配合，由于产生热膨胀失配，从而产生残余应力场，提高了陶瓷复合材料的导热率，增强了陶瓷复合材料的韧性，有效的提高了陶瓷复合材料的强度。
Aluminum nitride ceramic composite material for electronic packaging and preparation method thereof
一种电子封装用氮化铝陶瓷复合材料及制法
WANG QIAN (Autor:in) / GONG PENGCHENG (Autor:in) / GONG BOCHANG (Autor:in) / REN XUEMEI (Autor:in)
02.11.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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