Method for preparing ceramic circuit board through low-temperature sintering: Fid-Bau Portal

Method for preparing ceramic circuit board through low-temperature sintering

CHEN MINGXIANG / LIU JIAXIN / LIU SONGPO / HUANG WEIJUN

The invention discloses a method for preparing a ceramic circuit board through low-temperature sintering, and the method comprises the steps: firstly adding active metal particles into nano metal particles, adding an organic solvent, and carrying out the stirring and defoaming treatment to obtain nano metal active soldering paste; coating the surface of the ceramic substrate with active soldering paste through silk-screen printing; covering copper foil on the active soldering paste layer, and carrying out the sintering at low temperature (less than 300 DEG C) to obtain the ceramic copper-clad plate; and finally, forming a pattern on the copper layer through photoetching, developing and etching processes to obtain a single-sided or double-sided ceramic circuit board. The copper foil and the ceramic substrate can be directly bonded by using the active metal element, and the nano metal particles are adopted to reduce the sintering temperature, so that the high-strength ceramic copper-clad plate is obtained. Compared with an existing preparation method of a thick film printing ceramic substrate (TPC), a direct bonding copper-ceramic substrate (DBC) and an active metal welding ceramic substrate (AMB), the preparation method is simple in process and low in sintering temperature, and meets the packaging and heat dissipation requirements of power devices.

本发明公开了一种低温烧结制备陶瓷电路板方法，包括首先向纳米金属颗粒中添加活性金属颗粒，并加入有机溶剂，经搅拌、脱泡处理后得到纳米金属活性焊膏；然后在陶瓷基片表面通过丝网印刷涂覆活性焊膏；再在活性焊膏层上覆盖铜箔，经过低温烧结(<300℃)得到陶瓷覆铜板；最后通过光刻、显影和刻蚀工艺在铜层上形成图形，得到单面或双面陶瓷电路板。利用活性金属元素可以实现铜箔与陶瓷基片直接键合，采用纳米金属颗粒降低烧结温度，得到高强度陶瓷覆铜板。与现有厚膜印刷陶瓷基板(TPC)、直接键合铜‑陶瓷基板(DBC)和活性金属焊接陶瓷基板(AMB)制备方法相比，本发明工艺简单，烧结温度低，满足功率器件封装及散热需求。

Zugriff

Download

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren